Nec B58944 Datasheet (2026)

Pin 1 may be identified by a chamfered edge or dot on the package. Always verify with a multimeter before applying power.

Reliability, sourcing, and repair considerations

): Low junction-to-case resistance to allow for massive heat transfer to a heatsink. Common Applications nec b58944 datasheet

Efficient heat management is vital for the B58944 to prevent thermal runaway. Maximum 150°C to 175°C. Storage Temperature ( Tstgcap T sub s t g end-sub ): -55°C to +175°C. Thermal Resistance (

Indicated by the "-70" suffix in its equivalent part numbers, signifying a 70ns access time. Pin 1 may be identified by a chamfered

(Note: Pin functional mappings are derived from standard D43256 automotive SRAM interfaces; always verify physical board traces during hardware diagnosis.) Functional Pin Groupings

This section defines how the component performs under normal conditions. Look for the DC Current Gain ( hFEh sub cap F cap E end-sub Common Applications Efficient heat management is vital for

In the automotive repair sector, the NEC B58944 is a frequent point of interest for engineers working with older generation vehicle modules. It is commonly found in:

Architecturally, the device provides of memory organized in an 8-bit parallel configuration (